San Diego State University

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Power Integrity Modeling and Design for Semiconductors and Systems

Prentice Hall, November 29, 2007, 496 pages

Introduces power delivery network components, analysis, high-frequency measurement, and modeling requirements Presents these and other advanced case studies: high-speed servers, high-speed differential signaling, chip package analysis, embedded decoupling capacitors, and electromagnetic bandgap structures Translated to Japanese and simplified Chinese

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Journals

[1]	Francisco Coronado and Arif Ege Engin. Passos: Passive approximation through sum-of-squares orthogonal rational functions. IEEE Transactions on Electromagnetic Compatibility, 65(2):555--563, 2023. [ bib | DOI | .pdf ]
[2]	Andrew Ma and Arif Ege Engin. Orthogonal rational approximation of transfer functions for high-frequency circuits. International Journal of Circuit Theory and Applications, n/a(n/a), 2022. [ bib | DOI | arXiv | .pdf ]
[3]	Arif Ege Engin. Passive scalar function approximation using sos polynomials. IEEE Transactions on Electromagnetic Compatibility, pages 1--6, 2022. [ bib | DOI | http ]
[4]	Wilder A. Alarcon, A. Ege Engin, Ivan Ndip, and Klaus-Dieter Lang. Ebg common-mode filter design using uncoupled coplanar waveguide to microstrip transitions. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2(3):81--84, 2020. [ bib | DOI | http ]
[5]	Robert B. Paul, A. Ege Engin, and Jerry Aguirre. Dielectric and underfill characterization using cavity resonators for millimeter-wave applications. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2(3):76--80, 2020. [ bib | DOI | .pdf ]
[6]	Alvaro Valera-Rivera and Arif Ege Engin. Aaa algorithm for rational transfer function approximation with stable poles. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 3(3):92--95, 2021. [ bib | DOI | .pdf ]
[7]	A. E. Engin, I. Ndip, K. Lang, and G. Aguirre. Mixed-port scattering and hybrid parameters for high-speed differential lines. IEEE Transactions on Electromagnetic Compatibility, pages 1--8, 2018. [ bib | DOI | .pdf ]
[8]	A. E. Engin, N. Modi, and H. Oomori. Stepped-impedance common-mode filter for differential lines enhanced with resonant planes. IEEE Transactions on Electromagnetic Compatibility, pages 1--8, 2018. [ bib | DOI | .pdf ]
[9]	A. E. Engin, I. Ndip, K. Lang, and J. Aguirre. Closed-form multipole debye model for time-domain modeling of lossy dielectrics. IEEE Transactions on Electromagnetic Compatibility, pages 1--3, 2018. [ bib | DOI | .pdf ]
[10]	A. E. Engin, I. Ndip, K. D. Lang, and G. Aguirre. Nonoverlapping power/ground planes for suppression of power plane noise. IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(1):50--56, Jan 2018. [ bib | DOI | .pdf ]
[11]	A. E. Engin, I. Ndip, K. D. Lang, and G. Aguirre. Power plane filter using higher order virtual ground fence. IEEE Transactions on Components, Packaging and Manufacturing Technology, PP(99):1--7, 2017. [ bib | DOI | .pdf ]
[12]	Brian Curran, Ivan Ndip, Ege Engin, Jorg Bauer, Harald Poetter, Klaus-Dieter Lang, and Herbert Reichl. A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures. Journal of Microelectronics and Electronic Packaging, 11(3):115--121, 2014. [ bib | DOI | .pdf ]
[13]	A. E. Engin, C. Fergusson, Q. F. Su, and J. Aguirre. Power archipelago for filtering power plane noise. IEEE Transactions on Electromagnetic Compatibility, 58(5):1602--1608, Oct 2016. [ bib | DOI | .pdf ]
[14]	A.E. Engin. Passive multiport RC model extraction for through silicon via interconnects in 3-D ICs. Electromagnetic Compatibility, IEEE Transactions on, PP(99):1--7, 2014. [ bib | .pdf ]
[15]	A.E. Engin and J. Bowman. Virtual ground fence for GHz power filtering on printed circuit boards. Electromagnetic Compatibility, IEEE Transactions on, 55(6):1277--1283, 2013. [ bib | .pdf ]
[16]	A.E. Engin and S.R. Narasimhan. Modeling of crosstalk in through silicon vias. Electromagnetic Compatibility, IEEE Transactions on, 55(1):149--158, 2013. [ bib | DOI | .pdf ]
[17]	A. Ege Engin and Pavithra Pasunoori. Automated complex permittivity characterization of ceramic substrates considering surface-roughness loss. Journal of Microelectronics and Electronic Packaging, 9:144--148, 2012. [ bib | .pdf ]
[18]	Yulei Zhang, Xiang Hu, A. Deutsch, A.E. Engin, J.F. Buckwalter, and Chung-Kuan Cheng. Prediction and comparison of high-performance on-chip global interconnection. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 19(7):1154 --1166, july 2011. [ bib | DOI | .pdf ]
[19]	F. Ohnimus, G. Fotheringham, I. Ndip, A. A. Engin, S. Guttowski, H. Reichl, and K. Lang. Integration of planar antennas considering electromagnetic interactions at board level. Electromagnetic Compatibility, IEEE Transactions on, PP(99):1 --11, 2011. [ bib | DOI | .pdf ]
[20]	A.E. Engin. An arnoldi algorithm for power-delivery networks with variable dielectric constant and loss tangent. Electromagnetic Compatibility, IEEE Transactions on, 52(4):859 --865, nov. 2010. [ bib | DOI | .pdf ]
[21]	A.E. Engin. Efficient sensitivity calculations for optimization of power delivery network impedance. Electromagnetic Compatibility, IEEE Transactions on, 52(2):332 --339, may 2010. [ bib | DOI | .pdf ]
[22]	A. E. Engin. Extraction of dielectric constant and loss tangent using new rapid plane solver and analytical debye modeling for printed circuit boards. Microwave Theory and Techniques, IEEE Transactions on, 58(1):211--219, Jan. 2010. [ bib | DOI | .pdf ]
[23]	K. Srinivasan, P. Yadav, A.E. Engin, M. Swaminathan, and Myunghyun Ha. Fast em/circuit transient simulation using laguerre equivalent circuit (sleec). IEEE Transactions on Electromagnetic Compatibility, 51(3):756--762, Aug. 2009. [ bib | DOI ]
[24]	Tae Hong Kim, M. Swaminathan, A.E. Engin, and B.J. Yang. Electromagnetic band gap synthesis using genetic algorithms for mixed signal applications. IEEE Transactions on Advanced Packaging, 32(1):13--25, Feb. 2009. [ bib | DOI ]
[25]	Subramanian N. Lalgudi, Ege Engin, Giorgio Casinovi, and Madhavan Swaminathan. Accurate transient simulation of interconnects characterized by band- limited data with propagation delay enforcement in a modified nodal analysis framework. IEEE Transactions on Electromagnetic Compatibility, 50(3):715--729, August 2008. [ bib ]
[26]	Prathap Muthana, Krishna Srinivasan, A. Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Boyd Wiedenman, Daniel Amey, Karl Dietz, and Sounak Banerji. Improvements in noise suppression for i/o circuits using embedded planar capacitors. IEEE Transactions on Advanced Packaging, 31(2):234--245, May 2008. [ bib ]
[27]	Prathap Muthana, A. Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Boyd Wiedenman, Daniel Amey, Karl Dietz, and Sounak Banerji. Design, modeling and characterization of embedded capacitor networks for core decoupling in the package. IEEE Transactions on Advanced Packaging, 30(4):809--822, November 2007. [ bib ]
[28]	R. Mandrekar, K. Srinivasan, E. Engin, and M. Swaminathan. Causality enforcement in transient co-simulation of signal and power delivery networks. IEEE Transactions on Advanced Packaging, 30(2):270--278, May 2007. [ bib ]
[29]	A. Ege Engin, Krishna Bharath, and Madhavan Swaminathan. Multilayered finite-difference method (m-fdm) for modeling of package and printed circuit board planes. IEEE Transactions on Electromagnetic Compatibility, 49(2):441--447, May 2007. [ bib ]
[30]	Yoshitaka Toyota, Arif Ege Engin, Madhavan Swaminathan, Kengo Iokibe, and Ryuji Koga. Miniaturization of planar EBG structure formed in power/ground plane of printed circuit board to suppress EMI and electromagnetic noise (in japanese). IEICE Transactions on Communications, J90-B(11):1135--1142, November 2007. [ bib ]
[31]	Yoshitaka Toyota, Arif Ege Engin, Tae Hong Kim, and Madhavan Swaminathan. Stopband analysis using dispersion diagram for two-dimensional electromagnetic bandgap structures in printed circuit boards. IEEE Microwave and Wireless Components Letters, 16(12):645--647, December 2006. [ bib ]
[32]	A. Ege Engin, Werner John, Grit Sommer, Wolfgang Mathis, and Herbert Reichl. Modeling of striplines between a power and a ground plane. IEEE Transactions on Advanced Packaging, 29(3):415--426, August 2006. [ bib ]
[33]	A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, and Herbert Reichl. Closed-form network representations of frequency-dependent rlgc parameters. International Journal of Circuit Theory and Applications, 33:463--485, November 2005. [ bib ]

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Conferences

[1]	Andria Lemus, Judith Settle, Carlos Akerlundh, and Arif Ege Engin. Adaptive frequency sampling algorithm on a vna. In IMAPS, Oct 2023. [ bib ]
[2]	Andria Lemus and Arif Ege Engin. Adaptive generation of rational function approximations for microwave network parameters. In 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023, pages 235--238, 2023. [ bib | DOI ]
[3]	Andria Lemus, Francisco Coronado, and Arif Ege Engin. Adaptive generation of passive rational function approximations for electromagnetic simulation. In 2023 International Applied Computational Electromagnetics Society Symposium (ACES), pages 1--2, 2023. [ bib | DOI ]
[4]	Andria Lemus and Arif Ege Engin. Causal or not? a definite answer for frequency-response data. In 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), pages 1--3, 2023. [ bib | DOI ]
[5]	Francisco Coronado and Arif Ege Engin. Passive modeling of one-port networks through sos orthogonal rational functions. In 2022 IEEE 26th Workshop on Signal and Power Integrity (SPI), pages 1--4, 2022. [ bib | DOI ]
[6]	Francisco Coronado and Arif Ege Engin. Passive modeling of interconnects using sum of squares partial fraction expansions. In 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), pages 1--3, 2022. [ bib | DOI ]
[7]	Francisco Coronado and Arif Ege Engin. Sum of squares partial fractions: Application in modeling of interconnects in heterogeneous integration. In 2022 IEEE ICSJ, pages 1--3, 2022. [ bib | DOI ]
[8]	Andrew Ma, Daniel Deaton, and Arif Ege Engin. Stabilized sanathanan-koerner iteration for rational transfer function approximation of scattering parameters. In IMAPS, Oct 2021. [ bib ]
[9]	A. E. Engin, I. Ndip, and K. D. Lang. Mixed-mode hybrid parameters for high-speed differential lines. In IMAPS, Oct 2018. [ bib ]
[10]	Robert B. Paul, A. Ege Engin, and Jerry Aguirre. Flip-chip underfill rf characterization. In IMAPS, Oct 2019. [ bib ]
[11]	A. E. Engin, I. Ndip, K. D. Lang, and J. Aguirre. Differential-line characterization using mixed-port scattering parameters. In IEEE NEMO, Aug 2018. [ bib ]
[12]	A. E. Engin, J. Aguirre, J. Walker, and E. Graddy. Dielectric thickness, constant, and loss tangent characterization of ceramic substrates. In IMAPS CICMT, Mar 2017. [ bib ]
[13]	N. P. Modi, A. Olivera, A. E. Engin, and H. Oomori. Resonant-plane common-mode filter in differential lines. In 2017 IEEE CPMT Symposium Japan (ICSJ), pages 235--238, Nov 2017. [ bib | DOI ]
[14]	A. E. Engin, I. Ndip, K. D. Lang, and G. Aguirre. Non-overlapping power/ground planes for localized power distribution network design. In IEEE EDAPS, Dec 2016. [ bib ]
[15]	A. E. Engin, I. Ndip, K. D. Lang, and G. Aguirre. Determination of dielectric thickness, constant, and loss tangent from cavity resonators. In IEEE EPTC, Nov 2016. [ bib ]
[16]	A. E. Engin. Stepped-impedance common-mode filter in differential lines. In 2016 IEEE CPMT Symposium Japan (ICSJ), pages 209--212, Nov 2016. [ bib | DOI ]
[17]	A. E. Engin, I. Ndip, and K. D. Lang. Higher-order virtual ground fence design for filtering power plane noise. In 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), pages 1--3, May 2016. [ bib | DOI ]
[18]	Qianfei Su Su, A. Ege Engin, and Jerry Aguirre. Electrical characterization of low-profile copper foil for reduced surface roughness loss - best paper of the session award. In IMAPS, oct. 2016. [ bib ]
[19]	C. Ferguson and A.E. Engin. Power archipelago for ghz power filtering on printed circuit boards. In Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on, pages 193--196, March 2015. [ bib | DOI ]
[20]	A. Ege Engin and J. Bowman. Virtual ground fence options for shielding power plane noise. In Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on, pages 460--464, Aug 2014. [ bib | DOI ]
[21]	A. Ege Engin and Eva Kozachenko. Generalized debye model for pcb dielectrics and conductors. In EMC'14 Tokyo, Tokyo, Japan, May 2014. [ bib ]
[22]	Hansel Dsilva and A. Ege Engin. Dielectric constant, loss tangent, and surface-roughness loss characterization of ceramic substrates. In IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT),, apr. 2014. [ bib ]
[23]	A.E. Engin and J. Bowman. Power distribution network design and characterization using virtual ground fence. In Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th, pages 393--396, 2012. [ bib | DOI ]
[24]	A.E. Engin. Equivalent circuit model extraction for interconnects in 3d ics. In Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific, pages 1--6, 2013. [ bib | DOI ]
[25]	A.E. Engin, B. Adepu, M. Kusumoto, and T. Harada. Macromodeling of complex power delivery networks for efficient transient simulation. In CPMT Symposium Japan, 2012 2nd IEEE, pages 1--4, 2012. [ bib | DOI ]
[26]	A.E. Engin and N.S. Raghavan. Modeling of coupled tsvs in 3d ics. In Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on, pages 7--11, 2012. [ bib | DOI ]
[27]	Srinidhi Raghavan N. and A. Ege Engin. High frequency signal propagation in through silicon vias. In IMAPS 45th International Symposium on Microelectronics, sep. 2012. [ bib ]
[28]	Jesse Bowman and A. Ege Engin. Virtual ground fence: A simple method for protection against high frequency simultaneous switching noise. In IMAPS 45th International Symposium on Microelectronics, sep. 2012. [ bib ]
[29]	A. Ege Engin and Srinidhi Raghavan N. Analytical modeling of coupled TSVs in 3D ICs. In IMAPS System Packaging Workshop, November 2011. [ bib | DOI ]
[30]	Jesse Bowman and A. Ege Engin. Virtual ground fence for power filtering on ic packages and printed circuit boards. In IMAPS Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging, feb 2012. [ bib ]
[31]	A. Ege Engin and Jesse Bowman. Virtual ground fence: A methodology for ghz power filtering on printed circuit boards. In Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on, pages 421 --424, may 2012. [ bib | DOI ]
[32]	A. Ege Engin and Srinidhi Raghavan N. Metal semiconductor (MES) TSVs in 3D ICs: Electrical modeling and design. In IEEE International 3D System Integration Conference (3DIC), February 2012. [ bib | DOI ]
[33]	A. Ege Engin. Debye model fitting for time-domain modeling of lossy dielectrics. In IMAPS 43rd International Symposium on Microelectronics, nov. 2010. [ bib ]
[34]	Femi Akinwale and A. Ege Engin. A novel approach to the measurement and characterization of losses due to surface roughness in high speed transmission lines. In IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT),, apr. 2011. [ bib ]
[35]	Pavithra Pasunoori and A. Ege Engin. Automated dielectric constant and loss tangent characterization using cavity resonators. In Electromagnetic Compatibility, 2011. EMC 2011. IEEE International Symposium on, aug. 2011. [ bib ]
[36]	Ki Jin Han, Madhavan Swaminathan, and Ege Engin. Wideband electrical modeling of large three-dimensional interconnects using accelerated generation of partial impedances with cylindrical conduction mode basis functions. In Microwave Symposium Digest, 2008 IEEE MTT-S International, pages 1297 --1300, jun. 2008. [ bib | DOI ]
[37]	Wanping Zhang, Ling Zhang, A. Shayan, Wenjian Yu, Xiang Hu, Zhi Zhu, E. Engin, and Chung-Kuan Cheng. On-chip power network optimization with decoupling capacitors and controlled-esrs. In Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific, pages 119 --124, jan. 2010. [ bib | DOI ]
[38]	A. Shayan, Xiang Hu, Wanping Zhang, Chung-Kuan Cheng, A.E. Engin, Xiaoming Chen, and M. Popovich. 3d stacked power distribution considering substrate coupling. In Computer Design, 2009. ICCD 2009. IEEE International Conference on, pages 225 --230, oct. 2009. [ bib | DOI ]
[39]	Peng Du, Xiang Hu, Shih-Hung Weng, A. Shayan, Xiaoming Chen, A. Ege Engin, and Chung-Kuan Cheng. Worst-case noise prediction with non-zero current transition times for early power distribution system verification. In Quality Electronic Design (ISQED), 2010 11th International Symposium on, pages 624 --631, mar. 2010. [ bib | DOI ]
[40]	F. Ohnimus, I. Ndip, E. Engin, S. Guttowski, and H. Reichl. Comparison of electromagnetic field distribution in vicinity of patch and slot antennas. In Antennas Propagation Conference, 2009. LAPC 2009. Loughborough, pages 649 --652, nov. 2009. [ bib | DOI ]
[41]	F. Ohnimus, I. Ndip, E. Engin, S. Guttowski, and H. Reichl. Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas. In Antennas Propagation Conference, 2009. LAPC 2009. Loughborough, pages 737 --740, nov. 2009. [ bib | DOI ]
[42]	A. Ege Engin and Ivan Ndip. Reduction of signal line to power plane coupling using controlled-return-current transmission lines. In International Symposium on Microelectronics, San Jose, CA, November 2009. [ bib ]
[43]	A. Ege Engin. Extraction of dielectric constant and loss tangent of microwave substrates using full sheet resonance method - best paper of the session award. In IMAPS Advanced Technology Workshop On RF And Microwave Packaging, Sep. 2009. [ bib ]
[44]	Yulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin, James F. Buckwalter, and Chung-Kuan Cheng. Prediction of high-performance on-chip global interconnection. In SLIP '09: Proceedings of the 11th international workshop on System level interconnect prediction, pages 61--68, New York, NY, USA, 2009. ACM. [ bib | DOI ]
[45]	Xiang Hu, Wenbo Zhao, Peng Du, Yulei Zhang, Amirali Shayan, Christopher Pan, A. Ege Egin, and Chung-Kuan Cheng. On the bound of time-domain power supply noise based on frequency-domain target impedance. In SLIP '09: Proceedings of the 11th international workshop on System level interconnect prediction, pages 69--76, New York, NY, USA, 2009. ACM. [ bib | DOI ]
[46]	Wanping Zhang, Wenjian Yu, Xiang Hu, Amirali Shayan, A. Ege Engin, and Chung-Kuan Cheng. Predicting the worst-case voltage violation in a 3d power network. In SLIP '09: Proceedings of the 11th international workshop on System level interconnect prediction, pages 93--98, New York, NY, USA, 2009. ACM. [ bib | DOI ]
[47]	A. Kashi, N. Roy, E. Engin, and V. Devabhaktuni. A new multi-dimensional rf and microwave modeling algorithm based on rational interpolants and hybrid mapping. In Signal Integrity and High-Speed Interconnects, 2009. IMWS 2009. International Microwave Workshop Series on, pages 73--76, Feb. 2009. [ bib | DOI ]
[48]	A.E. Engin and M. Swaminathan. Power transmission lines: A new interconnect design to eliminate simultaneous switching noise. In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pages 1139--1143, May 2008. [ bib | DOI ]
[49]	Arif Ege Engin, Abdemanaf Tambawala, Madhavan Swaminathan, Pranabes Pramanik, and Kazuhiro Yamazaki. Causal modeling and extraction of dielectric constant and loss tangent for thin dielectrics. In IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, July 2007. [ bib ]
[50]	Arif Ege Engin, Abdemanaf Tambawala, Madhavan Swaminathan, Swapan Bhattacharya, Pranabes Pramanik, and Kazuhiro Yamazaki. Frequency-dependent dielectric constant and loss tangent characterization of thin dielectrics using a rapid solver. In Proc. Electronic Components and Technology Conference, Reno, NV, June 2007. [ bib ]
[51]	Arif Ege Engin, Krishna Bharath, and Madhavan Swaminathan. Analysis for signal and power integrity using the multilayered finite difference method. In ISCAS, New Orleans, LA, May 2007. [ bib ]
[52]	A. Ege Engin, Yoshitaka Toyota, Tae Hong Kim, and Madhavan Swaminathan. Analysis and design of electromagnetic bandgap (ebg) structures for power plane isolation using 2d dispersion diagrams and scalability. In Proc. IEEE Workshop on Signal Propagation on Interconnects, Germany, May 2006. [ bib ]
[53]	A. Ege Engin, Abdemanaf Tambawala, Madhavan Swaminathan, Swapan Bhattacharya, Pranabes Pramanik, and Kazuhiro Yamazaki. Dielectric constant and loss tangent characterization of thin high-k dielectrics using corner-to-corner plane probing. In Proc. Electrical Performance of Electronic Packaging, pages 29--32, Scottsdale, AZ, October 2006. [ bib ]
[54]	A. Ege Engin, Krishna Bharath, Krishna Srinivasan, and Madhavan Swaminatha. Modeling of multilayered packages and boards using modal decomposition and finite difference methods. In IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, August 2006. [ bib ]
[55]	A. Ege Engin, Madhavan Swaminathan, and Yoshitaka Toyota. Finite difference modeling of multiple planes in packages. In International Zurich Symposium on Electromagnetic Compatibility, February 2006. [ bib ]
[56]	A. Ege Engin, Krishna Bharath, Madhavan Swaminathan, Moises Cases, Bhyrav Mutnury, Nam Pham, Daniel N de Araujo, and Erdem Matoglu. Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards. In Proc. Electronic Components and Technology Conference, May 2006. [ bib ]
[57]	Ki Jin Han, M. Swaminathan, and Ege Engin. Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects. In Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE, pages 421--424, June 2008. [ bib | DOI ]
[58]	J. Chandrasekhar, E. Engin, M. Swaminathan, K. Uriu, and T. Yamada. Noise induced jitter in differential signaling. In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pages 1755--1761, May 2008. [ bib | DOI ]
[59]	Ki Jin Han, M. Swaminathan, and E. Engin. Analysis of horizontal and vertical couplings in bonding wire interconnections using efie with cylindrical conduction mode basis functions. In Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on, pages 1--4, May 2008. [ bib | DOI ]
[60]	K. Bharath, E. Engin, and M. Swaminathan. Automatic package and board decoupling capacitor placement using genetic algorithms and m-fdm. In Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE, pages 560--565, June 2008. [ bib | DOI ]
[61]	Ki Jin Han, M. Swaminathan, and E. Engin. Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions. In Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, pages 1225--1230, May 2008. [ bib | DOI ]
[62]	K. Srinivasan, E. Engin, and M. Swaminathan. Fast fdtd simulation of multiscale 3d models using laguerre-mna. In Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on, pages 141--144, May 2007. [ bib | DOI ]
[63]	Tae Hong Kim, Ege Engin, M. Swaminathan, and P. Yadav. Automated tool for electromagnetic band gap (ebg) synthesis in mixed signal applications. In Microwave Conference, 2007. APMC 2007. Asia-Pacific, pages 1--4, Dec. 2007. [ bib | DOI ]
[64]	K. Bharath, E. Engin, M. Swaminathan, K. Uriu, and T. Yamada. Computationally efficient power integrity simulation for system-on-package applications. In Design Automation Conference, 2007. DAC '07. 44th ACM/IEEE, pages 612--617, June 2007. [ bib | DOI ]
[65]	K. Srinivasan, P. Yadav, E. Engin, and M. Swaminathan. Choosing the right number of basis functions in multiscale transient simulation using laguerre polynomials. In Proc. Electrical Performance of Electronic Packaging, pages 291--294, Atlanta, GA, October 2007. [ bib ]
[66]	Madhavan Swaminathan, Tae Hong Kim, Ege Engin, and Abdemanaf Tambawala. Electromagnetic bandgap structures - design, modeling and integration in mixed signal modules - best paper of the session award. In International Symposium on Microelectronics, San Jose, CA, November 2007. [ bib ]
[67]	Mohit Pathak, Souvik Mukherjee, Madhavan Swaminathan, Ege Engin, and Sung Kyu Lim. Placement and routing of rf embedded passive designs in LCP substrate. In IEEE International Conference on Computer Design, Lake Tahoe, CA, October 2007. [ bib ]
[68]	N. Sankaran, B.-W. Lee, V. Sundaram, E. Engin, M. Iyer, M. Swaminathan, and R. R. Tummala. Electrical characterization and design optimization of embedded chip in substrate cavities. In Proc. Electronic Components and Technology Conference, Reno, NV, June 2007. [ bib ]
[69]	Ki Jin Han, Ege Engin, and Madhavan Swaminathan. Cylindrical conduction mode basis functions for modeling of inductive couplings in system-in-package (sip). In Proc. Electrical Performance of Electronic Packaging, pages 361--364, Atlanta, GA, October 2007. [ bib ]
[70]	Madhavan Swaminathan and Arif Ege Engin. Modeling of signal and power integrity in system on package applications. In IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, July 2007. [ bib ]
[71]	Abdemanaf Tambawala, Ege Engin, Madhavan Swaminathan, Pranabes Pramanik, Kazuhiro Yamazaki, and John Andresakis. Compact electromagnetic bandgap structures for power plane isolation using high-k dielectrics - best paper award finalist in board-level design category. In DesignCon, Santa Clara, CA, February 2007. [ bib ]
[72]	Krishna Srinivasan, Ege Engin, and Madhavan Swaminathan. Fast fdtd simulation using laguerre polynomials in mna framework. In IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, July 2007. [ bib ]
[73]	Yoshitaka Toyota, Kengo Iokibe, Ryuji Koga, Arif Ege Engin, Tae Hong Kim, and Madhavan Swaminathan. Miniaturization of electromagnetic bandgap (ebg) structures with high-permeability magnetic metal film. In IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, July 2007. [ bib ]
[74]	Krishna Bharath, Arif Ege Engin, Madhavan Swaminathan, Kazuhide Uriu;, and Toru Yamada. Signal and power integrity co-simulation for multi-layered system on package modules. In IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, July 2007. [ bib ]
[75]	Krishna Srinivasan, Madhavan Swaminathan, and Ege Engin. Enhancement of laguerre-fdtd with initial conditions for fast transient em/circuit simulation. In Proc. Electronic Components and Technology Conference, Reno, NV, June 2007. [ bib ]
[76]	Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, and Toru Yamada. Efficient simulation of power/ground planes for SiP applications. In Proc. Electronic Components and Technology Conference, Reno, NV, June 2007. [ bib ]
[77]	Prathap Muthana, Krishna Srinivasan, Ege Engin, Madhavan Swaminathan, Rao Tummala, Daniel Amey, Karl Dietz, and Sounak Banerji. I/o decoupling in high speed packages using embedded planar capacitors. In Proc. Electronic Components and Technology Conference, Reno, NV, June 2007. [ bib ]
[78]	Daehyun Chung, Tae Hong Kim, Chunghyun Ryu, Ege Engin, Madhavan Swaminathan, and Joungho Kim. Effect of ebg structures for reducing noise in multi-layer pcbs for digital systems. In Proc. Electrical Performance of Electronic Packaging, pages 253--256, Scottsdale, AZ, October 2006. [ bib ]
[79]	Krishna Bharath, Ege Engin, Madhavan Swaminathan, Kazuhide Uriu, and Toru Yamada. Efficient modeling of package power delivery networks with fringing fields and gap coupling in mixed signal systems. In Proc. Electrical Performance of Electronic Packaging, pages 59--62, Scottsdale, AZ, October 2006. [ bib ]
[80]	Tae Hong Kim, Ege Engin, and Madhavan Swaminathan. Switching noise suppression in mixed signal system applications using electromagnetic band gap (EBG) synthesizer. In Proc. Electrical Performance of Electronic Packaging, pages 47--50, Scottsdale, AZ, October 2006. [ bib ]
[81]	S. N. Lalgudi, K. Srinivasan, G. Casinovi, R. Mandrekar, E. Engin, M. Swaminathan, and Y. Kretchmer. Causal transient simulation of systems characterized by frequency-domain data in a modified nodal analysis framework. In Proc. Electrical Performance of Electronic Packaging, pages 123--126, Scottsdale, AZ, October 2006. [ bib ]
[82]	Ki Jin Han, Hayato Takeuchi, Ege Engin, and Madhavan Swaminathan. Eye-pattern improvement for design of high-speed differential links using passive equalization. In Proc. Electrical Performance of Electronic Packaging, pages 241--244, Scottsdale, AZ, October 2006. [ bib ]
[83]	Tae Hong Kim, Daehyun Chung, Ege Engin, and Madhavan Swaminathan. A novel synthesis method for designing electromagnetic band gap (ebg) structures in packaged mixed signal systems - outstanding poster paper award. In Proc. Electronic Components and Technology Conference, May 2006. [ bib ]
[84]	Krishna Bharath, Ege Engin, Toyota Yoshitaka, and Madhavan Swaminathan. Modeling of ebg structures using the transmission matrix method. In Proc. Progress In Electromagnetics Research Symposium, March 2006. [ bib ]
[85]	Yoshitaka Toyota, A. Ege Engin, Madhavan Swaminathan, and Swapan Bhattacharya. Size reduction of electromagnetic bandgap (ebg) structures with new geometries and materials. In Proc. Electronic Components and Technology Conference, May 2006. [ bib ]
[86]	R. Mandrekar, K. Bharath, K. Srinivasan, E. Engin, and M. Swaminathan. System level signal and power integrity analysis methodology for system-in-package applications. In Design Automation Conference, San Francisco, CA, July 2006. [ bib ]
[87]	Rohan Mandrekar, Krishna Srinivasan, Ege Engin, and Madhavan Swaminathana. Causal transient simulation of passive networks with fast convolution. In Proc. IEEE Workshop on Signal Propagation on Interconnects, Germany, May 2006. [ bib ]
[88]	K. Srinivasan, P. Muthana, R. Mandrekar, E. Engin, J. Choi, and M. Swaminathan. Enhancement of signal integrity and power integrity with embedded capacitors in high-speed packages. In International Symposium on Quality Electronic Design, San Jose, CA, March 2006. [ bib ]
[89]	Yoshitaka Toyota, Arif Ege Engin, Tae Hong Kim, Madhavan Swaminathan, and Kazuhide Uriu. Stopband prediction with dispersion diagram for electromagnetic bandgap structures in printed circuit boards. In IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, August 2006. [ bib ]
[90]	Isaac Robin Abothu, Baik-Woo Lee, P. Markondeya Raj, Ege Engin, Prathap Muthana, Chong K Yoon, Madhavan Swaminathan, and Rao R. Tummala. Tailoring the temperature coefficient of capacitance (tcc), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications. In Proc. Electronic Components and Technology Conference, May 2006. [ bib ]
[91]	Prathap Muthana, Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Lixi Wan, S.K Bhattacharya, P.M. Raj, K.J. Lee, Mahesh Varadarajan, and Isaac Robin Abothu. Measurement, modeling and characterization of embedded capacitors for power delivery in the mid-frequency range. In Annual Symposium on Microelectronics, September 2005. [ bib ]
[92]	Wansuk Yun, Amit Bavisi, Venky Sundaram, Madhavan Swaminathan, and Ege Engin. 3d integration and characterization of high q passives on multilayer liquid crystalline polymer (m-lcp) based substrate. In Asia Pacific Microwave Conference, China, December 2005. [ bib ]
[93]	Krishna Srinivasan, Rohan Mandrekar, Ege Engin, and Madhavan Swaminathan. Power integrity/signal integrity co-simulation for fast design closure. In Proc. Electronics Packaging Technology Conference, Singapore, December 2005. [ bib ]
[94]	Rohan Mandrekar, Krishna Srinivasan, Ege Engin, and Madhavan Swaminathan. Co-simulation of signal and power delivery networks with causality. In Proc. Electrical Performance of Electronic Packaging, pages 337--340, Austin, October 2005. [ bib ]
[95]	Prathap Muthana, Madhavan Swaminathan, Ege Engin, P Markondeya Raj, and Rao Tummala. Mid frequency decoupling using embedded decoupling capacitors. In Proc. Electrical Performance of Electronic Packaging, pages 271--274, Austin, October 2005. [ bib ]
[96]	Prathap Muthana, Madhavan Swaminathan, Rao Tummala, P.Markondeya Raj, Ege Engin, Lixi Wan, Devarajan Balaraman, and Swapan Bhattacharya. Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems. In IEEE International Symposium on Electromagnetic Compatibility, Chicago, August 2005. [ bib ]
[97]	Ege Engin, Mart Coenen, Heiko Köhne, Grit Sommer, and Werner John. Three-wire analysis model to predict si and emc effects. In Proc. EMC'04 Sendai, Sendai, Japan, June 2004. [ bib ]
[98]	A. Ege Engin, Wolfgang Mathis, Werner John, and Grit Sommer. Lumped skin-effect model for interconnects. In International Symposium on Signals, Systems, and Electronics ISSSE'04, Linz, Austria, August 2004. [ bib ]
[99]	A. Ege Engin, Wolfgang Mathis, Werner John, and Grit Sommer. Time-domain modeling of skin effect for improved SI analysis of interconnect systems and packages. In EUROEM'04, Magdeburg, Germany, July 2004. [ bib ]
[100]	A. Ege Engin, Werner John, Grit Sommer, and Wolfgang Mathis. Three-conductor modeling of striplines at via discontinuities. In Proc. EMC'04 Sendai, pages 61--64, Sendai, Japan, June 2004. [ bib ]
[101]	A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, and Herbert Reichl. Time-domain modeling of lossy substrates with constant loss tangent. In Proc. IEEE Workshop on Signal Propagation on Interconnects, Heidelberg, Germany, May 2004. [ bib ]
[102]	A. Ege Engin, Mart Coenen, Heiko Köhne, Grit Sommer, and Werner John. Modeling and analysis of the return path discontinuity caused by vias using the 3-conductor model. In IEEE International Symposium on Electromagnetic Compatibility, Istanbul, Turkey, May 2003. [ bib ]
[103]	A. Ege Engin, Werner John, Grit Sommer, and Wolfgang Mathis. Modeling of non-ideal planes in stripline structures. In Proc. Electrical Performance of Electronic Packaging, pages 247--250, Princeton, USA, October 2003. [ bib ]
[104]	Ege Engin, Mart Coenen, Heiko Köhne, Grit Sommer, and Werner John. Three-pole analysis model to predict si and emc effects. In EMC Compo, 3rd International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 105--108, Toulouse, France, November 2002. [ bib ]

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