mybib_journals.bib
@comment{{This file has been generated by bib2bib 1.99}}
@comment{{Command line: bib2bib -s $type journals.bib -ob mybib.bib}}
@article{https://doi.org/10.1002/cta.4468,
author = {Lemus, Andria and Ege Engin, Arif},
title = {AGORA: Adaptive Generation of Orthogonal Rational Approximations for Frequency-Response Data},
journal = {International Journal of Circuit Theory and Applications},
year = {2025},
pages = {},
keywords = {macromodeling, rational functions, scattering parameters, stability, vector fitting},
doi = {https://doi.org/10.1002/cta.4468},
abstract = {ABSTRACT This paper introduces the adaptive generation of orthogonal rational approximations (AGORA) method for rational function approximation of measured or simulated microwave network parameters. The output of AGORA is a state-space model or a rational function model that is representative of the input data. The generated model can then be used to interpolate the data or to evaluate the data quality. A typical application is the time-domain signal and power integrity analysis in circuit simulations using the generated model from measured or simulated interconnnects and power distribution networks. AGORA allows estimating the model order for a given error tolerance and does not require any initial estimates or adjustment of hyperparameters.},
url = {http://engineering.sdsu.edu/engin/pubs/Circuit Theory Apps - 2025 - Lemus - AGORA Adaptive Generation of Orthogonal Rational Approximations for-2.pdf}
}
@article{10049282,
author = {Coronado, Francisco and Engin, Arif Ege},
journal = {IEEE Transactions on Electromagnetic Compatibility},
title = {PASSOS: Passive Approximation Through Sum-of-Squares Orthogonal Rational Functions},
year = {2023},
volume = {65},
number = {2},
pages = {555-563},
url = {http://engineering.sdsu.edu/engin/pubs/PASSOS_Passive_Approximation_Through_Sum-of-Squares_Orthogonal_Rational_Functions.pdf},
doi = {10.1109/TEMC.2023.3243085}
}
@article{https://doi.org/10.1002/cta.3488,
author = {Ma, Andrew and Engin, Arif Ege},
title = {Orthogonal rational approximation of transfer functions for high-frequency circuits},
journal = {International Journal of Circuit Theory and Applications},
volume = {n/a},
number = {n/a},
pages = {},
keywords = {macromodeling, rational function, transfer function, vector fitting},
doi = {https://doi.org/10.1002/cta.3488},
year = {2022},
url = {http://engineering.sdsu.edu/engin/pubs/cta3488.pdf},
eprint = {https://onlinelibrary.wiley.com/doi/pdf/10.1002/cta.3488},
abstract = {Summary This paper introduces the orthogonal rational approximation (ORA) algorithm for rational function approximation of transfer functions, based on data available from simulations or measurements. A rational function allows integration of such data in transient solvers for analysis of high-frequency circuits. In rational function approximation, the unknown denominator polynomial of the model results in a nonlinear problem, which can be replaced with successive solutions of linearized problems following the Sanathanan–Koerner (SK) iteration. An orthogonal basis can be obtained based on Arnoldi resulting in a stabilized SK iteration. We present an extension of the stabilized SK, called ORA, which ensures real polynomial coefficients and stable poles for realizability of electrical networks. We also introduce an efficient implementation of ORA for multiport networks based on a block QR decomposition.}
}
@article{9698241,
author = {Engin, Arif Ege},
journal = {IEEE Transactions on Electromagnetic Compatibility},
title = {Passive Scalar Function Approximation Using SOS Polynomials},
year = {2022},
volume = {},
number = {},
pages = {1-6},
doi = {10.1109/TEMC.2021.3140198},
url = {http://engineering.sdsu.edu/engin/pubs/Passive_Scalar_Function_Approximation_Using_SOS_Polynomials.pdf
}
}
@article{9177054,
author = {Alarcon, Wilder A. and Engin, A. Ege and Ndip, Ivan and Lang, Klaus-Dieter},
journal = {IEEE Letters on Electromagnetic Compatibility Practice and Applications},
title = {EBG Common-Mode Filter Design Using Uncoupled Coplanar Waveguide to Microstrip Transitions},
year = {2020},
volume = {2},
number = {3},
pages = {81-84},
doi = {10.1109/LEMCPA.2020.3019449},
url = {http://engineering.sdsu.edu/engin/pubs/EBG_Common-Mode_Filter_Design_Using_Uncoupled_Coplanar_Waveguide_to_Microstrip_Transitions.pdf
}
}
@article{9159622,
author = {Paul, Robert B. and Engin, A. Ege and Aguirre, Jerry},
journal = {IEEE Letters on Electromagnetic Compatibility Practice and Applications},
title = {Dielectric and Underfill Characterization Using Cavity Resonators for Millimeter-Wave Applications},
year = {2020},
volume = {2},
number = {3},
pages = {76-80},
doi = {10.1109/LEMCPA.2020.3014391},
url = {http://engineering.sdsu.edu/engin/pubs/Dielectric_and_Underfill_Characterization_Using_Cavity_Resonators_for_Millimeter-Wave_Applications.pdf}
}
@article{9512266,
author = {Valera-Rivera, Alvaro and Engin, Arif Ege},
journal = {IEEE Letters on Electromagnetic Compatibility Practice and Applications},
title = {AAA Algorithm for Rational Transfer Function Approximation With Stable Poles},
year = {2021},
volume = {3},
number = {3},
pages = {92-95},
doi = {10.1109/LEMCPA.2021.3104455},
url = {http://engineering.sdsu.edu/engin/pubs/AAA_Algorithm_for_Rational_Transfer_Function_Approximation_With_Stable_Poles.pdf}
}
@article{8421638,
author = {A. E. Engin and I. Ndip and K. Lang and G. Aguirre},
journal = {IEEE Transactions on Electromagnetic Compatibility},
title = {Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines},
year = {2018},
volume = {},
number = {},
pages = {1-8},
keywords = {Scattering parameters;Scattering;Integrated circuits;Impedance;Transmission line matrix methods;Transmission line measurements;Power transmission lines;Current division factor;differential lines;mixed-mode scattering parameters;mode conversion},
doi = {10.1109/TEMC.2018.2855040},
issn = {0018-9375},
month = {},
url = {http://engineering.sdsu.edu/engin/pubs/08421638.pdf}
}
@article{8434097,
author = {A. E. Engin and N. Modi and H. Oomori},
journal = {IEEE Transactions on Electromagnetic Compatibility},
title = {Stepped-Impedance Common-Mode Filter for Differential Lines Enhanced With Resonant Planes},
year = {2018},
volume = {},
number = {},
pages = {1-8},
keywords = {Impedance;Stripline;Microstrip;Attenuation;Periodic structures;Insertion loss;Dielectrics;Common-mode filter;differential lines;electromagnetic bandgap filter;mixed-mode scattering parameters},
doi = {10.1109/TEMC.2018.2862636},
issn = {0018-9375},
month = {},
url = {http://engineering.sdsu.edu/engin/pubs/08434097.pdf}
}
@article{8382319,
author = {A. E. Engin and I. Ndip and K. Lang and J. Aguirre},
journal = {IEEE Transactions on Electromagnetic Compatibility},
title = {Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics},
year = {2018},
volume = {},
number = {},
pages = {1-3},
keywords = {Integrated circuit modeling;Dielectric losses;Bandwidth;Dielectric constant;Permittivity;Time-domain analysis;Causality;complex permittivity;Debye model;dielectric constant;loss tangent},
doi = {10.1109/TEMC.2018.2838522},
issn = {0018-9375},
month = {},
url = {http://engineering.sdsu.edu/engin/pubs/08382319.pdf}
}
@article{8103060,
author = {A. E. Engin and I. Ndip and K. D. Lang and G. Aguirre},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
title = {Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise},
year = {2018},
volume = {8},
number = {1},
pages = {50-56},
keywords = {Capacitors;Couplings;Frequency measurement;Impedance;Inductance;Switches;Transmission line measurements;Materials characterization;power and ground (PG) planes;power distribution network;power integrity;simultaneous switching noise},
doi = {10.1109/TCPMT.2017.2764801},
issn = {2156-3950},
month = {Jan},
url = {http://engineering.sdsu.edu/engin/pubs/08103060.pdf}
}
@article{7820155,
author = {A. E. Engin and I. Ndip and K. D. Lang and G. Aguirre},
journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
title = {Power Plane Filter Using Higher Order Virtual Ground Fence},
year = {2017},
volume = {PP},
number = {99},
pages = {1-7},
keywords = {Materials characterization;power and ground planes;power distribution network;power integrity;simultaneous switching noise.},
doi = {10.1109/TCPMT.2016.2637300},
issn = {2156-3950},
month = {},
url = {http://engineering.sdsu.edu/engin/pubs/07820155.pdf}
}
@article{doi:10.4071/imaps.421,
author = { Brian Curran and Ivan Ndip and Ege Engin and Jorg Bauer and Harald Poetter and Klaus-Dieter Lang and Herbert Reichl },
title = {A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive Structures},
journal = {Journal of Microelectronics and Electronic Packaging},
volume = {11},
number = {3},
pages = {115-121},
year = {2014},
doi = {10.4071/imaps.421},
url = {http://engineering.sdsu.edu/engin/pubs/imaps2E421.pdf}
}
@article{7494972,
author = {A. E. Engin and C. Fergusson and Q. F. Su and J. Aguirre},
journal = {IEEE Transactions on Electromagnetic Compatibility},
title = {Power Archipelago for Filtering Power Plane Noise},
year = {2016},
volume = {58},
number = {5},
pages = {1602-1608},
keywords = {embedded systems;integrated circuit noise;lumped parameter networks;microwave filters;mixed analogue-digital integrated circuits;radiofrequency integrated circuits;discrete elements;embedded elements;lumped element microwave filter;mixed-signal systems;noise coupling;noise filtering;power archipelago;power distribution networks;power plane noise;sensitive radio-frequency integrated circuits;Impedance;Metamaterials;Periodic structures;Rough surfaces;Shape;Surface impedance;Surface roughness;Materials characterization;power and ground planes;power distribution network (PDN);power integrity;simultaneous switching noise},
doi = {10.1109/TEMC.2016.2576646},
issn = {0018-9375},
month = {Oct},
url = {http://engineering.sdsu.edu/engin/pubs/07494972.pdf}
}
@article{6719510,
author = {Engin, A.E.},
journal = {Electromagnetic Compatibility, IEEE Transactions on},
title = {Passive Multiport {RC} Model Extraction for Through Silicon Via Interconnects in {3-D} {IC}s},
year = {2014},
volume = {PP},
number = {99},
pages = {1-7},
issn = {0018-9375},
url = {http://engineering.sdsu.edu/engin/pubs/06719510.pdf}
}
@article{6525356,
author = {Engin, A.E. and Bowman, J.},
journal = {Electromagnetic Compatibility, IEEE Transactions on},
title = {Virtual Ground Fence for {GHz} Power Filtering on Printed Circuit Boards},
year = {2013},
volume = {55},
number = {6},
pages = {1277-1283},
issn = {0018-9375},
url = {http://engineering.sdsu.edu/engin/pubs/06525356.pdf}
}
@article{6238321,
author = {Engin, A.E. and Narasimhan, S.R.},
journal = {Electromagnetic Compatibility, IEEE Transactions on},
title = {Modeling of Crosstalk in Through Silicon Vias},
year = {2013},
volume = {55},
number = {1},
pages = {149-158},
keywords = {MIS devices;equivalent circuits;integrated circuit modelling;three-dimensional integrated circuits;transmission line theory;varactors;2D quasistatic simulations;3D full-wave electromagnetic simulations;3D integrated circuit;MIS transmission lines;MOS varactor capacitance;circuit simulators;coupled TSV structures;coupled through silicon via structures;crosstalk modeling;dielectric quasiTEM modes;equivalent circuit model;metal-insulator-semiconductor transmission lines;metal-oxide-semiconductor varactor capacitance;multiconductor transmission line approach;silicon medium;slow-wave-TEM modes;Analytical models;Capacitance;Dielectrics;Inductance;Integrated circuit modeling;Silicon;Through-silicon vias;3D IC;crosstalk;metal–insular–semiconductor (MIS) transmission line;through silicon via (TSV)},
doi = {10.1109/TEMC.2012.2206816},
issn = {0018-9375},
url = {http://engineering.sdsu.edu/engin/pubs/06238321.pdf}
}
@article{imapscicmt12,
author = {Engin, A. Ege and Pasunoori, Pavithra },
journal = {Journal of Microelectronics and Electronic Packaging},
title = {Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness Loss
},
year = {2012},
month = {},
volume = {9},
number = {},
pages = {144-148},
keywords = {},
issn = {1551-4897},
url = {http://engineering.sdsu.edu/engin/pubs/jmep12q3_paper6.pdf}
}
@article{5463287,
author = {Yulei Zhang and Xiang Hu and Deutsch, A. and Engin, A.E. and Buckwalter, J.F. and Chung-Kuan Cheng},
journal = {Very Large Scale Integration (VLSI) Systems, IEEE Transactions on},
title = {Prediction and Comparison of High-Performance On-Chip Global Interconnection},
year = {2011},
month = {july },
volume = {19},
number = {7},
pages = {1154 -1166},
keywords = {high-performance on-chip global interconnection;on-chip T-line technology;on-chip global wire;on-chip transmission line technology;wire communication reliability;interconnections;network synthesis;system-on-chip;transmission lines;wires (electric);},
doi = {10.1109/TVLSI.2010.2047415},
issn = {1063-8210},
url = {http://engineering.sdsu.edu/engin/pubs/05463287.pdf}
}
@article{5875879,
author = {Ohnimus, F. and Fotheringham, G. and Ndip, I. and Engin, A. A. and Guttowski, S. and Reichl, H. and Lang, K.},
journal = {Electromagnetic Compatibility, IEEE Transactions on},
title = {Integration of Planar Antennas Considering Electromagnetic Interactions at Board Level},
year = {2011},
month = { },
volume = {PP},
number = {99},
pages = {1 -11},
keywords = {},
doi = {10.1109/TEMC.2011.2131656},
issn = {0018-9375},
url = {http://engineering.sdsu.edu/engin/pubs/05875879.pdf}
}
@article{5599859,
author = {Engin, A.E.},
journal = {Electromagnetic Compatibility, IEEE Transactions on},
title = {An Arnoldi Algorithm for Power-Delivery Networks With Variable Dielectric Constant and Loss Tangent},
year = {2010},
month = {nov. },
volume = {52},
number = {4},
pages = {859 -865},
keywords = {block Arnoldi algorithm;chip packages;dielectric permittivity;frequency-domain simulation;impedance matrix;loss tangent;network matrix;power series expansion;power-delivery network;printed circuit boards;tracking-sensitivity algorithm;variable dielectric constant;chip scale packaging;impedance matrix;permittivity;power electronics;printed circuits;},
doi = {10.1109/TEMC.2010.2075933},
issn = {0018-9375},
url = {http://engineering.sdsu.edu/engin/pubs/05599859.pdf}
}
@article{5424016,
author = {Engin, A.E.},
journal = {Electromagnetic Compatibility, IEEE Transactions on},
title = {Efficient Sensitivity Calculations for Optimization of Power Delivery Network Impedance},
year = {2010},
month = {may },
volume = {52},
number = {2},
pages = {332 -339},
keywords = {adjoint system method;decoupling capacitors;efficient sensitivity calculation algorithm;frequency-domain design;minimax problem;multiobjective optimization problem;objective function;power delivery network impedance;capacitors;circuit optimisation;frequency-domain analysis;integrated circuit design;sensitivity analysis;},
doi = {10.1109/TEMC.2010.2042059},
issn = {0018-9375},
url = {http://engineering.sdsu.edu/engin/pubs/05424016.pdf}
}
@article{5352338,
title = {Extraction of Dielectric Constant and Loss Tangent Using New Rapid Plane Solver and Analytical Debye Modeling for Printed Circuit Boards},
author = {Engin, A. E.},
journal = {Microwave Theory and Techniques, IEEE Transactions on},
year = {2010},
month = {Jan. },
volume = {58},
number = {1},
pages = {211-219},
doi = {10.1109/TMTT.2009.2036338},
issn = {0018-9480},
url = {http://engineering.sdsu.edu/engin/pubs/IEEE_MTT_DK_DF.pdf}
}
@article{5159534,
title = {Fast EM/Circuit Transient Simulation Using Laguerre Equivalent Circuit (SLeEC)},
author = {Srinivasan, K. and Yadav, P. and Engin, A.E. and Swaminathan, M. and Myunghyun Ha},
journal = {IEEE Transactions on Electromagnetic Compatibility},
year = {2009},
month = {Aug. },
volume = {51},
number = {3},
pages = {756-762},
keywords = {circuit simulation, computational electromagnetics, equivalent circuits, finite difference time-domain analysis, polynomialsLaguerre equivalent circuit, Laguerre finite-difference time domain, Laguerre polynomials, circuit transient simulation, equivalent circuit model, fast EM simulation, linear transient circuit simulation, memory solution, nodal analysis, time-efficient solution, transient EM simulation, transient electromagnetic simulation},
doi = {10.1109/TEMC.2009.2024158},
issn = {0018-9375}
}
@article{4785322,
title = {Electromagnetic Band Gap Synthesis Using Genetic Algorithms for Mixed Signal Applications},
author = {Tae Hong Kim and Swaminathan, M. and Engin, A.E. and Yang, B.J.},
journal = {IEEE Transactions on Advanced Packaging},
year = {2009},
month = {Feb. },
volume = {32},
number = {1},
pages = {13-25},
keywords = {finite difference methods, genetic algorithms, mixed analogue-digital integrated circuits, photonic band gapautomated design procedure, dispersion diagram method, electromagnetic band gap synthesis, genetic algorithms, mixed signal, multilayer finite-difference method, planar structures},
doi = {10.1109/TADVP.2008.2005841},
issn = {1521-3323}
}
@article{lalgudi07_1,
author = {Subramanian N. Lalgudi and Ege Engin and Giorgio Casinovi and Madhavan Swaminathan},
title = {Accurate Transient Simulation of Interconnects Characterized by Band-
Limited Data With Propagation Delay Enforcement in a Modified Nodal
Analysis Framework},
journal = {IEEE Transactions on Electromagnetic Compatibility},
volume = {50},
number = {3},
month = aug,
year = {2008},
pages = {715-729}
}
@article{prathap07_2,
author = {Prathap Muthana and Krishna Srinivasan and A. Ege Engin and
Madhavan Swaminathan and Rao Tummala and Venkatesh Sundaram and Boyd
Wiedenman and Daniel Amey and Karl Dietz and Sounak Banerji},
title = {Improvements in Noise Suppression for I/O Circuits
Using Embedded Planar Capacitors},
journal = {IEEE Transactions on Advanced Packaging},
volume = {31},
number = {2},
month = may,
year = {2008},
pages = {234-245}
}
@article{prathap07_1,
author = {Prathap Muthana and A. Ege Engin and
Madhavan Swaminathan and Rao Tummala and Venkatesh Sundaram and Boyd
Wiedenman and Daniel Amey and Karl Dietz and Sounak Banerji},
title = {Design, Modeling and Characterization of
Embedded Capacitor Networks for Core Decoupling
in the Package},
journal = {IEEE Transactions on Advanced Packaging},
volume = {30},
number = {4},
month = nov,
year = {2007},
pages = {809-822}
}
@article{engin06_7,
author = {R. Mandrekar and K. Srinivasan and E. Engin and M. Swaminathan},
title = {Causality enforcement in transient co-simulation of signal and power delivery networks},
journal = {IEEE Transactions on Advanced Packaging},
volume = {30},
number = {2},
month = may,
year = {2007},
pages = {270-278}
}
@article{engin07_1,
author = {A. Ege Engin and Krishna Bharath and Madhavan Swaminathan},
title = {Multilayered Finite-Difference Method (M-FDM) for Modeling of Package and Printed Circuit Board Planes},
journal = {IEEE Transactions on Electromagnetic Compatibility},
volume = {49},
number = {2},
month = may,
year = {2007},
pages = {441-447}
}
@article{toyota07_2,
author = {Yoshitaka Toyota and Arif Ege Engin and Madhavan Swaminathan and Kengo Iokibe and Ryuji Koga},
title = {Miniaturization of Planar {EBG} Structure Formed in Power/Ground Plane of Printed Circuit Board to Suppress {EMI} and Electromagnetic Noise (in Japanese)},
journal = {IEICE Transactions on Communications},
volume = {J90-B},
number = {11},
month = nov,
year = {2007},
pages = {1135-1142}
}
@article{engin06_13,
author = {Yoshitaka Toyota and Arif Ege Engin and Tae Hong Kim and Madhavan Swaminathan},
title = {Stopband Analysis Using Dispersion Diagram for
Two-dimensional Electromagnetic Bandgap
Structures in Printed Circuit Boards},
journal = {IEEE Microwave and Wireless Components Letters},
volume = {16},
number = {12},
month = dec,
year = {2006},
pages = {645-647}
}
@article{engin06_6,
author = {A. Ege Engin and Werner John and Grit Sommer and Wolfgang Mathis and Herbert Reichl},
title = {Modeling of Striplines between a Power and a Ground Plane},
journal = {IEEE Transactions on Advanced Packaging},
volume = {29},
number = {3},
month = aug,
year = {2006},
pages = {415-426}
}
@article{engin05_2,
author = {A. Ege Engin and Wolfgang Mathis and Werner John and Grit Sommer and Herbert Reichl},
title = {Closed-form network representations of frequency-dependent RLGC parameters},
journal = {International Journal of Circuit Theory and Applications},
volume = {33},
number = {},
month = nov,
year = {2005},
pages = {463-485}
}