[1]	Andria Lemus and Arif Ege Engin. Agora: Adaptive generation of orthogonal rational approximations for frequency-response data. International Journal of Circuit Theory and Applications, 2025. [ bib | DOI | .pdf ]
[2]	Francisco Coronado and Arif Ege Engin. Passos: Passive approximation through sum-of-squares orthogonal rational functions. IEEE Transactions on Electromagnetic Compatibility, 65(2):555--563, 2023. [ bib | DOI | .pdf ]
[3]	Andrew Ma and Arif Ege Engin. Orthogonal rational approximation of transfer functions for high-frequency circuits. International Journal of Circuit Theory and Applications, n/a(n/a), 2022. [ bib | DOI | arXiv | .pdf ]
[4]	Arif Ege Engin. Passive scalar function approximation using sos polynomials. IEEE Transactions on Electromagnetic Compatibility, pages 1--6, 2022. [ bib | DOI | http ]
[5]	Wilder A. Alarcon, A. Ege Engin, Ivan Ndip, and Klaus-Dieter Lang. Ebg common-mode filter design using uncoupled coplanar waveguide to microstrip transitions. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2(3):81--84, 2020. [ bib | DOI | http ]
[6]	Robert B. Paul, A. Ege Engin, and Jerry Aguirre. Dielectric and underfill characterization using cavity resonators for millimeter-wave applications. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2(3):76--80, 2020. [ bib | DOI | .pdf ]
[7]	Alvaro Valera-Rivera and Arif Ege Engin. Aaa algorithm for rational transfer function approximation with stable poles. IEEE Letters on Electromagnetic Compatibility Practice and Applications, 3(3):92--95, 2021. [ bib | DOI | .pdf ]
[8]	A. E. Engin, I. Ndip, K. Lang, and G. Aguirre. Mixed-port scattering and hybrid parameters for high-speed differential lines. IEEE Transactions on Electromagnetic Compatibility, pages 1--8, 2018. [ bib | DOI | .pdf ]
[9]	A. E. Engin, N. Modi, and H. Oomori. Stepped-impedance common-mode filter for differential lines enhanced with resonant planes. IEEE Transactions on Electromagnetic Compatibility, pages 1--8, 2018. [ bib | DOI | .pdf ]
[10]	A. E. Engin, I. Ndip, K. Lang, and J. Aguirre. Closed-form multipole debye model for time-domain modeling of lossy dielectrics. IEEE Transactions on Electromagnetic Compatibility, pages 1--3, 2018. [ bib | DOI | .pdf ]
[11]	A. E. Engin, I. Ndip, K. D. Lang, and G. Aguirre. Nonoverlapping power/ground planes for suppression of power plane noise. IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(1):50--56, Jan 2018. [ bib | DOI | .pdf ]
[12]	A. E. Engin, I. Ndip, K. D. Lang, and G. Aguirre. Power plane filter using higher order virtual ground fence. IEEE Transactions on Components, Packaging and Manufacturing Technology, PP(99):1--7, 2017. [ bib | DOI | .pdf ]
[13]	Brian Curran, Ivan Ndip, Ege Engin, Jorg Bauer, Harald Poetter, Klaus-Dieter Lang, and Herbert Reichl. A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures. Journal of Microelectronics and Electronic Packaging, 11(3):115--121, 2014. [ bib | DOI | .pdf ]
[14]	A. E. Engin, C. Fergusson, Q. F. Su, and J. Aguirre. Power archipelago for filtering power plane noise. IEEE Transactions on Electromagnetic Compatibility, 58(5):1602--1608, Oct 2016. [ bib | DOI | .pdf ]
[15]	A.E. Engin. Passive multiport RC model extraction for through silicon via interconnects in 3-D ICs. Electromagnetic Compatibility, IEEE Transactions on, PP(99):1--7, 2014. [ bib | .pdf ]
[16]	A.E. Engin and J. Bowman. Virtual ground fence for GHz power filtering on printed circuit boards. Electromagnetic Compatibility, IEEE Transactions on, 55(6):1277--1283, 2013. [ bib | .pdf ]
[17]	A.E. Engin and S.R. Narasimhan. Modeling of crosstalk in through silicon vias. Electromagnetic Compatibility, IEEE Transactions on, 55(1):149--158, 2013. [ bib | DOI | .pdf ]
[18]	A. Ege Engin and Pavithra Pasunoori. Automated complex permittivity characterization of ceramic substrates considering surface-roughness loss. Journal of Microelectronics and Electronic Packaging, 9:144--148, 2012. [ bib | .pdf ]
[19]	Yulei Zhang, Xiang Hu, A. Deutsch, A.E. Engin, J.F. Buckwalter, and Chung-Kuan Cheng. Prediction and comparison of high-performance on-chip global interconnection. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on, 19(7):1154 --1166, july 2011. [ bib | DOI | .pdf ]
[20]	F. Ohnimus, G. Fotheringham, I. Ndip, A. A. Engin, S. Guttowski, H. Reichl, and K. Lang. Integration of planar antennas considering electromagnetic interactions at board level. Electromagnetic Compatibility, IEEE Transactions on, PP(99):1 --11, 2011. [ bib | DOI | .pdf ]
[21]	A.E. Engin. An arnoldi algorithm for power-delivery networks with variable dielectric constant and loss tangent. Electromagnetic Compatibility, IEEE Transactions on, 52(4):859 --865, nov. 2010. [ bib | DOI | .pdf ]
[22]	A.E. Engin. Efficient sensitivity calculations for optimization of power delivery network impedance. Electromagnetic Compatibility, IEEE Transactions on, 52(2):332 --339, may 2010. [ bib | DOI | .pdf ]
[23]	A. E. Engin. Extraction of dielectric constant and loss tangent using new rapid plane solver and analytical debye modeling for printed circuit boards. Microwave Theory and Techniques, IEEE Transactions on, 58(1):211--219, Jan. 2010. [ bib | DOI | .pdf ]
[24]	K. Srinivasan, P. Yadav, A.E. Engin, M. Swaminathan, and Myunghyun Ha. Fast em/circuit transient simulation using laguerre equivalent circuit (sleec). IEEE Transactions on Electromagnetic Compatibility, 51(3):756--762, Aug. 2009. [ bib | DOI ]
[25]	Tae Hong Kim, M. Swaminathan, A.E. Engin, and B.J. Yang. Electromagnetic band gap synthesis using genetic algorithms for mixed signal applications. IEEE Transactions on Advanced Packaging, 32(1):13--25, Feb. 2009. [ bib | DOI ]
[26]	Subramanian N. Lalgudi, Ege Engin, Giorgio Casinovi, and Madhavan Swaminathan. Accurate transient simulation of interconnects characterized by band- limited data with propagation delay enforcement in a modified nodal analysis framework. IEEE Transactions on Electromagnetic Compatibility, 50(3):715--729, August 2008. [ bib ]
[27]	Prathap Muthana, Krishna Srinivasan, A. Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Boyd Wiedenman, Daniel Amey, Karl Dietz, and Sounak Banerji. Improvements in noise suppression for i/o circuits using embedded planar capacitors. IEEE Transactions on Advanced Packaging, 31(2):234--245, May 2008. [ bib ]
[28]	Prathap Muthana, A. Ege Engin, Madhavan Swaminathan, Rao Tummala, Venkatesh Sundaram, Boyd Wiedenman, Daniel Amey, Karl Dietz, and Sounak Banerji. Design, modeling and characterization of embedded capacitor networks for core decoupling in the package. IEEE Transactions on Advanced Packaging, 30(4):809--822, November 2007. [ bib ]
[29]	R. Mandrekar, K. Srinivasan, E. Engin, and M. Swaminathan. Causality enforcement in transient co-simulation of signal and power delivery networks. IEEE Transactions on Advanced Packaging, 30(2):270--278, May 2007. [ bib ]
[30]	A. Ege Engin, Krishna Bharath, and Madhavan Swaminathan. Multilayered finite-difference method (m-fdm) for modeling of package and printed circuit board planes. IEEE Transactions on Electromagnetic Compatibility, 49(2):441--447, May 2007. [ bib ]
[31]	Yoshitaka Toyota, Arif Ege Engin, Madhavan Swaminathan, Kengo Iokibe, and Ryuji Koga. Miniaturization of planar EBG structure formed in power/ground plane of printed circuit board to suppress EMI and electromagnetic noise (in japanese). IEICE Transactions on Communications, J90-B(11):1135--1142, November 2007. [ bib ]
[32]	Yoshitaka Toyota, Arif Ege Engin, Tae Hong Kim, and Madhavan Swaminathan. Stopband analysis using dispersion diagram for two-dimensional electromagnetic bandgap structures in printed circuit boards. IEEE Microwave and Wireless Components Letters, 16(12):645--647, December 2006. [ bib ]
[33]	A. Ege Engin, Werner John, Grit Sommer, Wolfgang Mathis, and Herbert Reichl. Modeling of striplines between a power and a ground plane. IEEE Transactions on Advanced Packaging, 29(3):415--426, August 2006. [ bib ]
[34]	A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, and Herbert Reichl. Closed-form network representations of frequency-dependent rlgc parameters. International Journal of Circuit Theory and Applications, 33:463--485, November 2005. [ bib ]