[Scholarship_alert] Paper and Board Division Scholarship
Engineering Scholarships Alert
scholarship_alert at engineering.sdsu.edu
Fri Jan 15 07:45:36 PST 2010
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Program Number: 01368
Title: Paper and Board Division Scholarship
Sponsor: TAPPI Foundation
SYNOPSIS: The purpose of the Paper and Board Division
Scholarship Program is to encourage talented science and engineering
students to pursue careers in the paper industry and to utilize their
talents in advancing the science and technology of papermaking.
Deadline(s): 02/15/2010
Established Date: 01/13/2009
Follow-Up Date: 01/01/2011
Review Date: 01/14/2010
Contact:
Address: Scholarship Department
15 Technology Parkway South
Norcross, GA 30092
U.S.A.
E-mail: standards at tappi.org
Program URL: http://www.tappi.org/s_tappi/sec.asp?CID=6101&DID=546695
Tel: 770-209-7276
Fax: 770-446-6947
Deadline Ind: Receipt
Deadline Open: No
Award Type(s): Student Scholarship
Citizenship/Country of Applying Institution:
Any/No Restrictions
Locations Tenable: Any/No Restrictions
Appl Type(s): Undergraduate Student
Target Group(s): NONE
Funding Limit: $1,000
Duration: 1 YEAR(s)
Indirect Costs: Unspecified
Cost Sharing: No
Sponsor Type: Foundations
Geo. Restricted: NO RESTRICTIONS
CFDA#:
OBJECTIVES: The sponsor has established a scholarship program to
provide financial assistance to selected students in universities,
colleges, and other institutions of higher learning who are majoring
in scientific or technical disciplines related to the manufacture of
paper and paperboard.
ELIGIBILITY
To be eligible to apply for one of the Paper and Board Division
Scholarships, an applicant must meet the following criteria: A TAPPI
student member or an undergraduate member of a TAPPI Student Chapter;
Enrolled as a college or university undergraduate in an engineering or
science program; A full-time student or a full-time participant in a
cooperative work-study program recognized and supported by the
educational institution; A sophomore, junior, or senior in the fall;
and Able to show a significant interest in the paper industry.
FUNDING
The sponsor plans to award one or more $1000.00 scholarships
annually. (cas)
KEYWORDS: ENGINEERING
Industry
Technology
Paper/Pulp
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