[Scholarship_alert] TAPPI Foundation: Engineering Division Scholarship

Engineering Scholarships Alert scholarship_alert at engineering.sdsu.edu
Fri Jan 15 07:52:04 PST 2010


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Program Number:   01364 
Title:            Engineering Division Scholarship                                                                                                                                                                                                                               

Sponsor:          TAPPI Foundation 

SYNOPSIS:  The sponsor has established a scholarship program to 
promote interest in the pulp and paper industry among engineering and 
science students, and to increase the potential in following an 
engineering career among students with an interest in the pulp and 
paper industry. 

Deadline(s):      02/15/2010 
Established Date: 01/13/2009 
Follow-Up Date:   01/01/2011 
Review Date:      01/14/2010 

Contact:                                                                                                               

Address:          Scholarship Department 
                 15 Technology Parkway South 
                 Norcross, GA 30092       
                 U.S.A.                                  
E-mail:           standards at tappi.org 

Program URL: http://www.tappi.org/s_tappi/sec.asp?CID=6101&DID=546695 
Tel:              770-209-7276                   
Fax:              770-446-6947         
Deadline Ind:     Receipt                                                 
Deadline Open:    No 
                    


Award Type(s):    Student Scholarship 


Citizenship/Country of Applying Institution: 
                 Any/No Restrictions 

Locations Tenable:    Any/No Restrictions 


Appl Type(s):     Undergraduate Student 


Target Group(s):  NONE 
Funding Limit:    $1,500    
Duration:         0 
Indirect Costs:   Unspecified 
Cost Sharing:     No 
Sponsor Type:     Foundations 


Geo. Restricted:  NO RESTRICTIONS                                          

CFDA#:                        

OBJECTIVES:  Up to two scholarships will be offered. One may be 
awarded to a student who will be in his or her junior year (Rising 
Junior), and the other may be awarded to a student who will be in 
his/her senior year at the beginning of the next academic year (Rising 
Senior). In addition to the financial award, scholarship recipients 
will be encouraged to take summer employment in the pulp and paper 
industry. The Scholarship Committee will contact companies related to 
the pulp and paper industry on behalf of the scholarship recipients, 
to help them find summer employment with appropriate companies between 
their sophomore and junior, or junior and senior years, 
respectively. 

ELIGIBILITY 
To be eligible to apply for one of the scholarships, a candidate 
must be an undergraduate member of a TAPPI Student Chapter, or a 
student member of International TAPPI, or submit comparable evidence 
of professional development and participation relative to the paper 
industry, and must meet the following criteria: Enrolled in an 
engineering or science program; Attending college full-time; An 
upcoming junior or an upcoming senior; Maintaining a grade point 
average of 3.0/4.0, or higher; and Able to demonstrate a significant 
interest in the pulp and paper industry. 

FUNDING 
The sponsor will award up to two $1,500 scholarships. (cas) 

KEYWORDS:         ENGINEERING 
  



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