[Scholarship_alert] TAPPI Foundation: Engineering Division Scholarship
Engineering Scholarships Alert
scholarship_alert at engineering.sdsu.edu
Fri Jan 15 07:52:04 PST 2010
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Program Number: 01364
Title: Engineering Division Scholarship
Sponsor: TAPPI Foundation
SYNOPSIS: The sponsor has established a scholarship program to
promote interest in the pulp and paper industry among engineering and
science students, and to increase the potential in following an
engineering career among students with an interest in the pulp and
paper industry.
Deadline(s): 02/15/2010
Established Date: 01/13/2009
Follow-Up Date: 01/01/2011
Review Date: 01/14/2010
Contact:
Address: Scholarship Department
15 Technology Parkway South
Norcross, GA 30092
U.S.A.
E-mail: standards at tappi.org
Program URL: http://www.tappi.org/s_tappi/sec.asp?CID=6101&DID=546695
Tel: 770-209-7276
Fax: 770-446-6947
Deadline Ind: Receipt
Deadline Open: No
Award Type(s): Student Scholarship
Citizenship/Country of Applying Institution:
Any/No Restrictions
Locations Tenable: Any/No Restrictions
Appl Type(s): Undergraduate Student
Target Group(s): NONE
Funding Limit: $1,500
Duration: 0
Indirect Costs: Unspecified
Cost Sharing: No
Sponsor Type: Foundations
Geo. Restricted: NO RESTRICTIONS
CFDA#:
OBJECTIVES: Up to two scholarships will be offered. One may be
awarded to a student who will be in his or her junior year (Rising
Junior), and the other may be awarded to a student who will be in
his/her senior year at the beginning of the next academic year (Rising
Senior). In addition to the financial award, scholarship recipients
will be encouraged to take summer employment in the pulp and paper
industry. The Scholarship Committee will contact companies related to
the pulp and paper industry on behalf of the scholarship recipients,
to help them find summer employment with appropriate companies between
their sophomore and junior, or junior and senior years,
respectively.
ELIGIBILITY
To be eligible to apply for one of the scholarships, a candidate
must be an undergraduate member of a TAPPI Student Chapter, or a
student member of International TAPPI, or submit comparable evidence
of professional development and participation relative to the paper
industry, and must meet the following criteria: Enrolled in an
engineering or science program; Attending college full-time; An
upcoming junior or an upcoming senior; Maintaining a grade point
average of 3.0/4.0, or higher; and Able to demonstrate a significant
interest in the pulp and paper industry.
FUNDING
The sponsor will award up to two $1,500 scholarships. (cas)
KEYWORDS: ENGINEERING
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