<table cellspacing="0" cellpadding="0" border="0" ><tr><td valign="top" style="font: inherit;">yup<br><br>--- On <b>Thu, 3/25/10, Engineering Scholarships Alert <i><scholarship_alert@engineering.sdsu.edu></i></b> wrote:<br><blockquote style="border-left: 2px solid rgb(16, 16, 255); margin-left: 5px; padding-left: 5px;"><br>From: Engineering Scholarships Alert <scholarship_alert@engineering.sdsu.edu><br>Subject: Re: [Scholarship_alert] Harris (H. H.) Foundation Scholarships<br>To: scholarship_alert@kahuna.sdsu.edu<br>Date: Thursday, March 25, 2010, 6:46 PM<br><br><div class="plainMail">Please remove me from your mailing list. Thanks<br><br>-----Original Message-----<br>From: <a ymailto="mailto:scholarship_alert-bounces@engineering.sdsu.edu" href="/mc/compose?to=scholarship_alert-bounces@engineering.sdsu.edu">scholarship_alert-bounces@engineering.sdsu.edu</a><br>[mailto:<a ymailto="mailto:scholarship_alert-bounces@engineering.sdsu.edu"
 href="/mc/compose?to=scholarship_alert-bounces@engineering.sdsu.edu">scholarship_alert-bounces@engineering.sdsu.edu</a>] On Behalf Of<br>Engineering Scholarships Alert<br>Sent: Thursday, March 25, 2010 8:29 AM<br>To: <a ymailto="mailto:scholarship_alert@kahuna.sdsu.edu" href="/mc/compose?to=scholarship_alert@kahuna.sdsu.edu">scholarship_alert@kahuna.sdsu.edu</a><br>Cc: <a ymailto="mailto:eolevsky@mail.sdsu.edu" href="/mc/compose?to=eolevsky@mail.sdsu.edu">eolevsky@mail.sdsu.edu</a><br>Subject: [Scholarship_alert] Harris (H. H.) Foundation Scholarships<br><br><br>Title: Scholarships<br><br>Sponsor:          Harris (H. H.) Foundation <br><br>SYNOPSIS:  The sponsor provides scholarships and other forms of educational<br>aid to students and professionals in the metallurgical and casting of metals<br>field who are U.S. citizens. The average grant last year was in excess of<br>$1,000 per
 student.   <br><br>Deadline(s):      04/30/2010 <br>Established Date: 03/24/2010 <br>Follow-Up Date:   02/01/2011 <br>Review Date:      03/24/2010 <br><br>Contact:          Charles L. Michod, Jr.<br><br><br>Address:          333 West Wacker Drive <br>                 Suite 2000 <br>                 Chicago, IL 60606-1288 <br>                 U.S.A.                                  <br>E-mail:           <a ymailto="mailto:cmichod@komdr.com" href="/mc/compose?to=cmichod@komdr.com">cmichod@komdr.com</a> <br>Web Site: <a href="http://www.afsinc.org/content/view/664/"
 target="_blank">http://www.afsinc.org/content/view/664/</a> <br>Program URL: <a href="http://www.afsinc.org/images/Marketing/harris_scholarship.pdf" target="_blank">http://www.afsinc.org/images/Marketing/harris_scholarship.pdf</a> <br>Tel:              312-236-6700                   <br>Fax:              312-236-6706         <br>Deadline Ind:     Receipt                                                 <br>Deadline Open:    No <br>                    <br><br><br>Award Type(s):    Student Scholarship <br><br><br>Citizenship/Country of Applying Institution: <br>       
          U.S.A. Citizenship (including U.S. Territories) <br><br>Locations Tenable:    U.S.A. Institution (including U.S. Territories) <br><br><br>Appl Type(s):     Graduate Student <br>                 Individual, Non-Specific <br>                 Postdoctoral <br>                 Undergraduate Student <br><br><br>Target Group(s):  NONE <br>Funding Limit:    $1,000   AVERAGE <br>Duration:         0 <br>Indirect Costs:   Unspecified <br>Cost Sharing:     No <br>Sponsor Type:     NONE <br><br>Geo. Restricted:  NO RESTRICTIONS                             
             <br><br>CFDA#:                        <br><br>OBJECTIVES:  The sponsor offers scholarships and other forms of <br>financial aid to students and professionals  in the metallurgical and <br>metalcasting field. <br><br>ELIGIBILITY <br>&lt;p&gt;Applicants must be U.S. citizens.&lt;/p&gt; <br><br>FUNDING <br>The average grant last year was in excess of $1,000 per <br>student.  <br><br>KEYWORDS:         Metallurgy <br><br>_______________________________________________<br>Scholarship_alert mailing list<br><a ymailto="mailto:Scholarship_alert@engineering.sdsu.edu" href="/mc/compose?to=Scholarship_alert@engineering.sdsu.edu">Scholarship_alert@engineering.sdsu.edu</a><br><a href="http://attila.sdsu.edu/mailman/listinfo/scholarship_alert"
 target="_blank">http://attila.sdsu.edu/mailman/listinfo/scholarship_alert</a><br><br>_______________________________________________<br>Scholarship_alert mailing list<br><a ymailto="mailto:Scholarship_alert@engineering.sdsu.edu" href="/mc/compose?to=Scholarship_alert@engineering.sdsu.edu">Scholarship_alert@engineering.sdsu.edu</a><br><a href="http://attila.sdsu.edu/mailman/listinfo/scholarship_alert" target="_blank">http://attila.sdsu.edu/mailman/listinfo/scholarship_alert</a><br></div></blockquote></td></tr></table>