[Scholarship_alert] Fwd: Structural Materials Division Scholarship
Engineering Scholarships Alert
scholarship_alert at engineering.sdsu.edu
Mon Jan 11 12:15:06 PST 2010
>*********************************************************************************
>Program Number: 70426
>Title: Structural Materials Division
>Scholarship
>
>
>Sponsor: Minerals, Metals and Materials Society
>
>SYNOPSIS:
> Two $2,500 scholarships are available to undergraduate students
>majoring in metallurgical and/or materials science and engineering
>with an emphasis on the science and engineering of load-bearing
>materials, including studies into the nature of a material's physical
>properties based upon its microstructure and operating
>environment.
>
>Deadline(s): 03/15/2010
>Established Date: 10/16/2002
>Follow-Up Date: 01/01/2011
>Review Date: 12/23/2009
>
>Contact:
>
>
>Address: TMS Student Awards Program
> 184 Thorn Hill Road
> Warrendale, PA 15086
> U.S.A.
>E-mail: students at tms.org
>
>Program URL: http://www.tms.org/Students/Scholarships.aspx
>Tel: 724-776-9000
>Fax: 724-776-3770
>Deadline Ind: Receipt
>Deadline Open: No
>
>
>
>Award Type(s): Student Scholarship
>
>
>Citizenship/Country of Applying Institution:
> Any/No Restrictions
>
>Locations Tenable: Any/No Restrictions
>
>
>Appl Type(s): Undergraduate Student
>
>
>Target Group(s): NONE
>Funding Limit: $2,500
>Duration: 0
>Indirect Costs: Unspecified
>Cost Sharing: No
>Sponsor Type: Professional/Academic Assoc & Soc.
>
>
>Geo. Restricted: NO RESTRICTIONS
>
>CFDA#:
>
>OBJECTIVES:
> The sponsor awards scholarships to students majoring in
>metallurgical and/or materials science and engineering with an
>emphasis on the science and engineering of load-bearing materials,
>including studies into the nature of a material's physical properties
>based upon its microstructure and operating environment.
>
>ELIGIBILITY
> All applicants must be student members of the sponsor's
>organization. Applicants must be enrolled full time in a
>metallurgical/materials science engineering program at a qualified
>college or university. This scholarship is open to full-time
>undergraduate applicants in their sophomore or junior years.
>
>FUNDING
> Each recipient will receive a $2,500 stipend. Additionally, the
>scholarship recipient will be given up to $500 for travel expenses to
>the sponsor's Annual Meeting to accept his/her award. (cas)
>
>KEYWORDS: ENGINEERING
> Metallurgical Engineering
> Materials Sciences
> Materials, Physical Properties
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