[Scholarship_alert] Fwd: Center for Materials Science and Engineering Research Experience for Undergraduates Summer Internshi5172.20.0.211
Engineering Scholarships Alert
scholarship_alert at engineering.sdsu.edu
Mon Jan 11 12:07:19 PST 2010
>*********************************************************************************
>Program Number: 86876
>Title: Center for Materials Science and Engineering
>Research Experience for Undergraduates Summer Internship
>Program
>
>
>Sponsor: Massachusetts Institute of Technology
>
>SYNOPSIS:
> The sponsor provides an opportunity for students to participate in
>research under the supervision of faculty.
>
>Deadline(s): 02/12/2010
>Established Date: 02/10/2006
>Follow-Up Date: 12/01/2010
>Review Date: 12/16/2009
>
>Contact: Ms. Frances
>Page
>
>
>Address: Materials Processing Center
> 77 Massachusetts Avenue, Room 12-007
> Cambridge, MA 02139
> U.S.A.
>E-mail: fmpage at mit.edu
>Web Site: http://mpc-web.mit.edu/
>Program URL:
>http://mpc-web.mit.edu/index.php?option=com_content&view=article&id=136&Itemid=385
>Tel:
>Fax:
>Deadline Ind: Receipt
>Deadline Open: No
>
>
>
>Award Type(s): In-Residence
> Internships
> Summer
>
>
>Citizenship/Country of Applying Institution:
> U.S. Permanent Resident
> U.S.A. Citizenship (including U.S. Territories)
>
>Locations Tenable: U.S.A. Institution (including U.S. Territories)
>
>
>Appl Type(s): Undergraduate Student
>
>
>Target Group(s): NONE
>Funding Limit: $5,800 SEEBELOW
>Duration: 9 WEEK(s)
>Indirect Costs: Unspecified
>Cost Sharing: No
>Sponsor Type: College/University
>
>
>Geo. Restricted: NO RESTRICTIONS
>
>CFDA#:
>
>OBJECTIVES:
> The program started in 1983, and has brought hundreds of the best
>science and engineering undergraduates in the country to MIT for
>graduate-level materials research. A wide range of project areas is
>available. Interns select their own projects from faculty
>presentations given the first few days of the program.
>
>
>ELIGIBILITY
> Positions in the program are open to US Citizens or Permanent US
>Residents only. Applicants must be entering their junior or senior
>year.
>
>FUNDING
> There's a $5800 stipend, plus travel expenses (up to $1000).
>(cas)
>
>KEYWORDS: Materials Engineering
> Materials Sciences
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://engineering.sdsu.edu/pipermail/scholarship_alert/attachments/20100111/00a7cbab/attachment.htm>
More information about the Scholarship_alert
mailing list