[Scholarship_alert] Fwd: Summer Undergraduate Research in Engineering/Science Program (SURE)
Engineering Scholarships Alert
scholarship_alert at engineering.sdsu.edu
Mon Jan 11 12:04:52 PST 2010
>*********************************************************************************
>Program Number: 74076
>Title: Summer Undergraduate Research in
>Engineering/Science Program
>(SURE)
>
>
>Sponsor: Georgia Institute of Technology
>
>SYNOPSIS:
> SURE is a ten-week summer research program designed to attract
>qualified minority students into graduate school in the fields of
>engineering and science.
>
>Deadline(s): 03/01/2010
>Established Date: 04/21/2003
>Follow-Up Date: 01/01/2011
>Review Date: 12/16/2009
>
>Contact: Dr. Gary S.
>May
>
>
>Address: School of Electrical and Computer Engineering
> Georgia Tech
> Atlanta, GA 30332
> U.S.A.
>E-mail: gary.may at ece.gatech.edu
>
>Program URL: http://www.sure.gatech.edu/index.html
>Tel:
>Fax:
>Deadline Ind: Receipt
>Deadline Open: No
>
>
>
>Award Type(s): In-Residence
> Internships
> Summer
> Training/Professional Development
>
>
>Citizenship/Country of Applying Institution:
> Any/No Restrictions
>
>Locations Tenable: U.S.A. Institution (including U.S. Territories)
>
>
>Appl Type(s): Minority Individual
> Undergraduate Student
>
>
>Target Group(s): NONE
>Funding Limit: $5,000 SEEBELOW
>Duration: 10 WEEK(s)
>Indirect Costs: Unspecified
>Cost Sharing: No
>Sponsor Type: College/University
>
>
>Geo. Restricted: NO RESTRICTIONS
>
>CFDA#:
>
>OBJECTIVES:
> Approximately thirty students of at least junior-level
>undergraduate standing are recruited on a nationwide basis and paired
>with both a faculty and a graduate student mentor to undertake
>research projects in the College of Engineering, College of Sciences,
>Packaging Research Center and the Georgia Tech Lab for New Electronic
>Materials (NSF MRSEC). Aside from their own research projects, the
>participants are provided with a series of seminars and field trips to
>expose them to the various topics of interest, both at Georgia Tech
>and in the Atlanta area.
>
>
>ELIGIBILITY
> Eligible applicants are undergraduate minority students.
>
>FUNDING
> The students are housed on campus, and in addition to a $600 travel
>allowance, are provided with a meal plan and a $5,000 stipend.
>(daj)
>
>KEYWORDS: Science Education
> Engineering Education
> Undergraduate Education
> Minority Education
> ENGINEERING
> Science, General/Other
> Packaging Sciences
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